MES Dashboard / Inverter Line
SIMULATED
real-time demo
⚠ 1 ALERT · 1 WATCH I030 Sinter temp deviation · recovery 4 min I040 Bond pull trending low · Cpk 1.26 Shift Afternoon · 2pm–10pm · line lead A. Keller
Inverter Line — EV traction inverter (power electronics)
Part in process #INV-2913 Bottleneck I030 · 130 s WO #0512 · 240 pcs
27/h
Output rate
96.1%
Line FPY
79%
OEE
96%
Bottleneck load I030
128
Inverters tested · shift
#WO-0512
Active order · 156/240
INVERTER LINE — POWER ELECTRONICS · FLOW → → FINISHED GOODS STOCK I010 50 s Paste print PASTE PRINT · DBC SUBSTRATE Paste volume 8.05 mm³ Print offset 9 µm Flatness 18 µm RUNNING #INV-2913 I020 70 s SiC module placement SiC MODULE PLACEMENT · PICK & PLACE Placement accuracy 11 µm Placement force 15.2 N Module temp 25.3 °C PLACING #INV-2912 I030 130 s · BOTTLENECK Silver sintering SILVER SINTER · 250°C UNDER PRESS Peak temp 251 °C Pressure 20.1 MPa Void ratio 1.3 % SINTERING 250°C #INV-2911 I040 95 s Wire bond & busbar WIRE BOND · BUSBAR · DC-LINK Bond pull force 8.1 N Busbar torque 9.0 Nm DC-link capacitance 502 µF BONDING #INV-2910 I050 110 s Housing & potting HOUSING · RESIN POTTING Resin volume 84.6 ml Cure time 90 s Seal torque 6.0 Nm POTTING #INV-2909 I060 60 s End-of-line test (HV) HV BENCH · DOUBLE PULSE · 100% CHECK Isolation resistance 512 MΩ Switching loss 11.7 mJ Output current 350 Arms TEST OK ✓ #INV-2908 OUTPUT tested inverters 128 INVERTERS · SHIFT FPY 96.1%
Stations Running Bonding Sinter / oven Test / inspection Fault Product DBC substrate → SiC modules → Sinter → Busbar / DC-link → Potting → Tested inverter Rate 27 inverters/h · bottleneck I030 130 s
Production & OEE — current shift RUNNING
79 %OEE
Availability88%
Performance93%
Quality96%
Parts this shift156 / 240 WO
Actual rate27 / 28 theor. · pcs/h
BottleneckI030 · 130 s
MTBF / MTTR52 min / 4.8 min
Scheduled time7.4 h
Today's stoppages — top causes 44 min total
Sinter temp deviation — I030 Sinter16 min
2 stops · SINTER_TEMP
Bond lift-off — I040 Wire bond12 min
3 stops · BOND_LIFT
Paste voids — I010 Paste print8 min
2 stops · PASTE_VOID
HV leakage retest — I060 EOL test5 min
1 stop · HV_LEAK
Die crack detected — I020 Placement3 min
1 stop · DIE_CRACK
Quality & SPC current shift
96.1%
FPY
2.6%
Scrap
1.3%
Rework
Cpk sinter temp (I030)1.34
Cpk bond pull (I040)1.26
Cpk isolation resistance (I060)1.58
Cpk DC-link capacitance (I040)1.47
SPC alerts1 · bond pull trend I040
Last scrap#INV-2896 · I030 void ratio high
Station status I010 → I060 · 6 stations
StationOperationStateCyclePartsFPYLast fault
I010Paste printRUNNING50 s16298.8%Paste voids · 2 h ago
I020SiC module placementPLACING70 s16199.2%Die crack · 3 h ago
I030Silver sinteringSINTERING130 s15997.6%Sinter temp · 35 min ago
I040Wire bond & busbarBONDING95 s15898.4%Bond lift-off · 1 h ago
I050Housing & pottingPOTTING110 s15799.3%—
I060EOL test (HV)TEST60 s15699.0%HV leakage retest · 4 h ago
Output rate — last 2 h pcs / h · target 28
min 23/havg 27/hmax 29/h · target 28/h
Simulated demo data · refreshed in real time